Rapidus Corporation, a manufacturer of advanced logic semiconductors, and multinational technology company IBM, today announced a joint development partnership aimed at establishing mass production technologies for chiplet packages. Through this agreement, Rapidus will receive packaging technology from IBM for high-performance semiconductors, and the two companies will collaborate with the aim to further innovate in this space.
IBM today announced the evolution and expansion of Qiskit, its globally adopted quantum software. Launched in 2017, Qiskit, as a software development kit (SDK) is an open-source tool that has allowed over 550,000 users to build and run quantum circuits on IBM’s quantum hardware systems, resulting in the execution of over 3 trillion quantum circuits to date.
Agreement outlines intent to research and develop solutions to new challenges related to processing performance, power consumption, and design complexity
Today, IBM (NYSE: IBM) has announced an agreement with RIKEN, a Japanese national research laboratory, to deploy IBM’s next-generation quantum computer architecture and best-performing quantum processor at the RIKEN Center for Computational Science in Kobe, Japan. It will be the only instance of a quantum computer co-located with the supercomputer Fugaku.
Rapidus and IBM Expand Collaboration to Chiplet Packaging Technology for 2nm-Generation Semiconductors
Honda and IBM Sign Memorandum of Understanding to Explore Long-term Joint Research and Development of Semiconductor Chip...